SolverPI-Powder 1600
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Product Name: Thermoplastic Polyimide Moulding Powder
Item No.: SolverPI-Powder 1600
Mesh size: =200 Mesh

SPECIFICATIONS:
Properties | Testing Method | Unit | Value | |
Basic performance | Appearance | / | / | Light Yellow |
Linear expansion coefficient of (23-30?) | GB/T 1036-1989 | 1/? | 3.68*10-5 | |
Density(25?) | / | g/cm3 | 1.38 | |
Intrinsic viscosity | Q/HSMT | dL/g | 0.5-0.8 | |
Rockwell hardness (m) | GB/T 3398.2-2008 | / | 110 | |
Oxygen index | GB/T 2406.2-2009 | % | 46 | |
The vertical combustion | GB/T 2408-2008 | level | V-0 | |
Mechanical properties of | The tensile strength | GB/T 1040.2/1A-2006 | MPa | 108 |
Elongation at break | GB/T 1040.2-2006 | % | 15 | |
The impact strength (no gap) | GB/ 1043.1/1eU-2008 | KJ/m2 | 244 | |
The bending strength | GB/T 9341-2008 | MPa | 135 | |
The compression strength | GB/ T 1041-2008 | MPa | 136 | |
The coefficient of friction | GB/T 3960-1983(1989) | / | 0.43 | |
Thermal performance | The thermal deformation temperature(1.80MPa) | GB/T 1634.2-2004 | ? | 250 |
Glass transition temperature (nitrogen atmosphere) | GB/T 19466.2-2009 | ? | 260 | |
Electrical properties | Dielectric strength | GB/T 1408.1-2006 | MV/m | 16.3 |
Volume resistivity | GB/T1410-2006 | O·m | 2.0*1014 | |
Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent.
Main Characteristics:
l Creep resistance, radiation resistance, good wave penetrating ability;
l Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;
l Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);
In a word, SOLVER Thermoplastic Polyimide Moulding Powder
(SolverPI-Powder 1600) can completely replace Mitsui AURUM.
Application:
Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc.
The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requirements.
Moulded Samples:

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