GRD240B

1 before surface mount (SMT), IC (CSP, BGA, TQFP, TSOP) at room temperature and low humidity and wet preservation;

2. The printed circuit board and multilayer substrate before lamination (pressed substrate) desiccant custody and style film and prepreg humidity preservation;

. all kinds of electronic installation, semi finished products of low humidity preservation and installation process before the process and secondary process prevention of oxidation and low humidity storage;

4 electronic machine with a ceramic substrate or a ceramic condenser was saved;

5 crystal oscillator manufacturing engineering in crystal chips, electrode materials, adhesive of low humidity storage;

IC and LSI use 6 naked before installing COB (bare wafer) lead frame of low humidity storage;