Si Target Silicon Sputtering Si Wafer Silicon Target Polycrystalline for TP and LCD

Silicon is of gray metallic luster. It has diamond lattice and is hard and brittle. Melting point: 1410 °C, boiling point: 2355 °C, density: 2.33g/cm3, purity: 99.999%. It is semiconductor material. Depending on the dopant, it can be N or P type. The silicon wafer is manufactured through vacuum magnetic levitation smelting or casting into ingots earlier, and slicing, lapping and precision machining later. Nowadays it is widely used for metal ceramic, aerospace, optical fiber communication, STN, Ai, TFT, TP, LCD, vehicle navigation, glass, semiconductor and other magnetron sputtering coating.