Rogers PCB 8 Layer Prototype PCB

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Features:

Rogers pcb multilayer pcb with high frequency can improvide the products quality ,

with high techolonogy treatment improve the life cycle of the products .

The high frequency rogers pcb with 4 mil 1 oz ,

also with DHI half hole blind buried techonology .

Immersion gold surface finish make the pcb 's conductive performance enhancements.

Multilayer pcb design ,the precision of the pcb improves much more better .

Low dielectric : 3 dielectric conductivity much more precision .

Rogers material used in RF Microwave fields in radar system .

Product Detail

Specification

6 layer

White solder mask, 

Model:XCEH

Copper THK: 1OZ

Location: Shenzhen

Prototype Pcb Service Of POE Switch Pcb Board Of Rogers 5880 Pcb

Key specifications/special features:

Key specifications/special features:

Rogers PCB

Rogers 4350B, Roger3003, Roger 5880 and more material on stock

PCB thickness: 0.2-2mm+/-10%

Final copper: 0.5-10oz

Min hole: 0.2mm

Min line width/space: 4/4mil

Min hole copper: 20µm/25µm

Solder mask: green/blue/red/black/gray/white

Legend: white/black/yellow

Surface: OSP/HAL lead-free/immersion gold/immersion tin/

immersion silver/flash gold/hard gold

Outline: rout and score/V-cut

E-test: 100%

Certificates: UL, SGS, RoHS Directive-compliant, ISO

Files: Gerber Protel DXP Auto CAD PADs eagle

Testing: flying probe test, E-test, X-ray Inspection, AOI

Solder mask: green/blue/red/black/gray/white

Legend: white/black/yellow

Surface: OSP/HAL lead-free/immersion gold/immersion tin/

immersion silver/flash gold/hard gold

Outline: rout and score/V-cut

E-test: 100%

Certificates: UL, SGS, RoHS Directive-compliant, ISO

Files: Gerber Protel DXP Auto CAD PADs eagle

Testing: flying probe test, E-test, X-ray Inspection, AOI

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.