PCB for High Frequency Devices

  • Description
Product Detail
Xinchenger Electronics is a professional manufacturer of high-tech products who can offer you pcb for high frequency devices with competitive price. Just be free to buy good pcb for high frequency devices at reasonable price with us and get the datasheet from our suppliers who can working for you.


Product Detail

Basic Info

  • Model NO.:XCE PCB

  • Dielectric:FR-4

  • Layer:1~20 Layers

  • Base Material:Fr1, Fr4, Cem-3, Aluminium, Ceramic

  • Copper Thickness:0.5~3.2mm

  • Surface Finishing:HASL,Lead Free HASL,OSP,Enig...

  • Board Thickness:0.5~3.2mm

  • Min. Line Spacing:0.08mm

  • Ring Annulus:Min 0.1mm

  • Layer to Layer Rrgistration:+/-0.003"

  • Hole Position Accuracy:+/-0.003"

  • Aspect Ratio:Min 1:8

  • Trademark:XCE

  • Specification:UL, SGS, RoHs, TS

  • Origin:Dalian, Liaoning

  • HS Code:8534009000




Parameter:

 

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling

 


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