Multi layer

Product design, system speed requirements, microprocessor and component scaling, and increased thermal performance are driving advances in PCB technology every day. Hemeixin’s technical and production capability and aggressive technology roadmap has kept pace with these changes and provides a scalable platform for growth.

• Layers (2-64)                                                  

• Lines and Spaces (Volume 3/3 Prototype 2/2)

• Controlled Impedance (+/- 10% Standard - +/- 5% Advanced)                             

• Blind and Buried Vias; Filled via capability                                                                                                               

• Buried Capacitance

  Dielectric thickness: 14 µm

  Capacitance /area: 6.4 nF/in2

  Breakdown Voltage: >100V

  3M material, no need license

• Buried Resistor

  Resistance (ohms/sq.) : 25, 50, 100, 200                                                                                                                                 

• Advanced thermal management and embedded coin technology
• High Performance and Emerging Materials; Halogen free,low     loss,ultra-thin,mixed packages, inlay
• Sequential Lamination

• High Tech Drilling Capability – Small hole drilling, Backdrilling  
• Mechanical depth control drilling with +/-10um tolerance,min drill
   size 0.15mm
• Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)
 

Solution