PCB Assembly
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Min Order
1
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Product Unit
Pieces
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Origin
China Mainland
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Payment
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- Description
Product Detail
TYPE: | pcb assembly |
DIP service | resistance/ capacitance/diode/transistor/ IC / IC socket.etc. |
SMT service | 0201/0402/0603/1206/particularity,etc |
Test type | Available on request |
Casing material | Metals/plastic/custom-made |
Business Type: | Manufacturers |
Packing
Standard export packing:
1.Standard :antistatic bays ,vacuum package,customized package.
2.Standard:K=K carton
Delivery time: 7-15 days after receipt deposit
Order flow
1.Check out:checkout and make payment for selected products
2.Upload file:please compress the files into one zip-file and upload it
3.Tech confirm: check every details for the files and communication
4. System:track everything in on place
5.shipping:please feel free to tell us do you like the experience or not
OEM Services :
Pcb assembly : SMT/RTH/Inspect
Pcba and pcb design
Components sourcing and purchasing
Quick prototyping
Plastic inection molding
Metal sheet stamping/die casting
Final assembly
Test: AOI ,In-Circuit Test,Functional Test
Requested information for pcb assembly
1.Gerber file of the bare pcb board
2.BOM for assembly(bill of material)
3.Testing Guide & Test file
4.Programming files&programming file
5.Schematic if necessary
6.Clear Pic. Of PCB or PCBA sample if available
Contract Printed Circuit Board (PCB) Assembly Services Specifications
Category | Description | Capability |
SMT Capability | Qty of SMT Line | 5 |
SMT Capacity | 35 Millions Per Day | |
Max Board Size | 457mm × 610mm | |
Min. Coponent Size | 0201 | |
BGA/µBGA | Available | |
DIP Capability | Qty of DIP Line | 3 |
DIP Capacity | 0.2 Millions Per Day | |
Max Board Width | 400 mm | |
Lead-free Line | Available | |
Max. Degree | 399 °C | |
Spray Flux Add-on | Available | |
Technical Data | Stencil Size | 736mm × 736mm |
Min. IC Pitch | 0.3mm | |
Max. IC Size | 50mm | |
Max. PCB Size | 1200mm × 500mm | |
Min. PCB Thickness | 0.35mm | |
Min. Chip Size | 0201 | |
Max. BGA Size | 74mm × 74mm | |
BGA Ball Pitch | Min. : 1.0mm Max. : 3.0mm | |
BGA Ball Diameter | Min. : 0.4 mm Max. : 1.0mm | |
OFP Lead Pitch | Min. : 0.38 mm Max. : 2.54mm | |
Turn Times | Quick turn are our specialty | |
Assembly Type | Surface Mount(SMT) Assembly | |
Thru-Hole Assembly | ||
Mixed(Surface Mount and Thru-Hole) | ||
Cable Assembly | ||
Box Build Assembly | ||
Technical Data | Stencil | Laser Cut Stainless Steel |
Part Procurements | Turnkey(We supply the Part) | |
Consigned(You Supply the Parts) | ||
You Supply some part,we do the rest | ||
Solder Type | Leaded | |
Lead-free/RoHS Compliant | ||
Other Capabilities | Repair/Rework Service | |
Mechanical Assembly | ||
Mould and Plastic Injection | ||
Material Sourcing | ||
Test and Inspection | AOI Test | |
X-Ray Inspection | ||
In-Circuit Test | ||
Solder Paste Insepct | ||
ATE Test | ||
Vibration Test | ||
Temp. & Humidity Test | ||
Function Test | ||
Certification | ISO 9001 , |
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