Silicone Thermal Conductive Pad for Labtop Heatsink

  • Description
Product Detail

Serial Number: DR40 T12 

Color: Any 

Hardness Shore C: 25-60 

Density: 3.09  g/cm³

Thermal Conductivity:  4.0 w/m*k

Thermal Impedance:  0.0071 m²k/w

Tensil strength:    0.12  MPa

Elongation:  84.2%   

Flame resistance:  V0 UL94

Weight loss:  =0.3% @150? 7 days

Resistance: 4.5×1011 O*cm

Dielectric Strength : =5 KV/mm


Features

1 Thermal conductivity: 4.0 W/m-K

2 Extended working time for

manufacturing flexibility

3 Ultra-conforming with excellent

wet-out

4 100% solids - no cure by-products

5 Excellent low and high temperature chemical and mechanical stability


Applications:

·Automotive electronics

·Computer and peripherals

·Between any heat-generating semiconductor and a heat sink

·Telecommunications


Stock: Gray color

Die-cutting service: available

Lead time: 1 day

MOQ: NO MOQ

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BBG Technology (HK) Ltd

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