AHL-EP25 Semiconductor Laser Marking

  • Description
Product Detail

Laser cutting is mainly used to melt some of the cut material or activity is not easily oxidized metal, such as stainless steel, titanium, aluminum and its alloys.

Laser oxygen cutting fold

Laser oxygen cutting principle is similar to oxyacetylene cutting. It is used as a preheating laser source, with oxygen and other reactive gas as cutting gas. Blowing out gas on the 


Send your message to this supplier
To:  

ATT Laser Technology Co., Ltd

* Content:  

For better quotations, include:

- A self introduction

- Special requests, if any

Quantity:  
  
You May Like
Not exactly what you want? One request, multiple quotations Get Quotations Now >>
8 YRS ATT Laser Technology Co., Ltd
China Mainland Favorites
Transaction Level:
Contact Us

* Quantity:

You May Like