Fibreboard Hard Fibre Board FR4

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Description

Product Detail

Fibreboard Hard Fibre Board Quick Details

Place of Origin: Liaoning, China (Mainland)

Brand Name: Youda

Model Number: FR4

Type: Insulation Sheet

Material: Fiberglass, copper foil, epoxy resin and glass fiber cloth

Application: High Voltage

Rated Voltage: conformance to requirements

Tensile Strength: conformance to requirements

Thickness: 0.8mm-2.0mm

Flammability: UL94V-0

Water Absorpotion: 0.15%

Certification: ISO9001,ISO14001,CQC,UL

Spot goods size(width and length):1020mmx1220mm

FR4 Copper Clad Laminate is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides. Usually used in PCB with printed circuit on one or both sides of computers, home electric appliances and other lines.

Advantage:

1.Higher mechanical properties,
2.Dielectric properties.
3.Good heat/moisture resistance .

4.Stable electric performance in high temperature.

5.Good flatness, smooth surface,no pits

Test Item	Test Condition	Unit	SPEC	Typical Value
Tg	DSC	°C	=125	135
Peel strength(1OZ)	288°C,10S	N/mm	=1.05	1.41
Thermal Stress	288°C,10S/solder dip	____	>10	60S/ No delamination No Delamination
Flexural Strength	N/mm2	LW	=415	500
Flexural Strength	N/mm2	CW	=345	450
Flammability	E24/125	____	UL94 V-0	V-0
Surface Resistivity	After moisture	MO	=1. 0×104	2.0×106
Volume Resistivity	After moisture	MO.cm	=1.0×106	2.0×108
Dielectric Constant(1MHZ)	1MHz C-24/23/50	____	=5.4	4.7
Dissipation Factor(1MHZ)	1MHz C-24/23/50	____	=0.035	0.017
Loss Tangent	1MHz C-24/23/50	____	=0.035	0.016
Arc Resistivity	D-48/50+D-0.5/23	S	=60	135
Dielectric Breakdown	D-48/50+D-0.5/23	KV	=40	60
Moisture Absorption	D-24/23	%	=0.8	0.15
CTI	IEC60112 Method	V	175~250	210