Bonded Fin / Bond Fin Heat Sink

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Bonded fin / bond fin heat sink

Our bonded fin heatsinks are manufactured from either aluminum or copper, or by using an extrusion process. Using either an epoxy or a solder / braze process, the fin is bonded to the base, hence the name bonded fin.

The resultant bonded fin heatsinks are designed to meet very specific needs. Should you have any question about using bonded fin, our knowledgeable consultants are available to discuss your specific needs and answer any questions you may have. It is important to choose the right product for cost, delivery time and effectiveness. The choice you make can crucial to your success.                                   

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Bonded / swaged heatsinks are generally designed for high power application accompanied with low thermal resistance. Forced air cooling is required for these bonded fin products.

When things get too hot or the box gets too small, bonded fins increase the heat sink surface area without increasing volume, and reduce thermal resistance by 1/2 to 2/3. Bonded fins provide cooling in forced convection for powers above 100 W. Learn more about Bonded Fins

Augmented Surface Bonded Fin
Reduce overall thermal resistance by 15 to 25% with patented technology for bonded fin heat sinks. Available in the same forms and sizes as the standard and custom bonded fin heat sinks, this option increases air flow turbulence while multiple, short air channels substantially increase heat removal.

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A simple call or e-mail will put you in touch with the experts who have the answers you require.

 


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ACG Cooler International Limited

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